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4G Multilayer PCB



Parasitic Plate
| Item | Technical capacity |
|---|---|
| Layer | 1~4L |
| Size | 20×30~50×400mm |
| Thickness | 0.5~1.8mm |
| SurfaceTreatment | Immersion Tin |
| Material | PTFE: Dk2.2, Dk2.5, Dk3.0, Dk3.5; HC:Dk3.0, Dk3.5 |
| Min bore | 0.4mm |
| Max Aspect Ratio | 6:1 |
| Special Design | PIM control |
| Reliability | Reflow: 3 times, Thermal stress 288℃*10s*3 times, non-layered bursting disc |