Our Products
5G Multilayer PCB
| Item | Technical capacity |
|---|---|
| Layer | 2~6L |
| Size | 200mm~75 mm |
| Thickness | 0.2~3.2 mm |
| Surface Treatment | Immersion Tin, ENIG |
| Material | RO4730G3, Aerowave300, HC298, H5300; RO4730G3+RO4450F RO4533+RO4450F; Aerowave300 + Aerobond300; Aerowave30 + SynamicB |
| Special Design | Back drill, Blind hole, POFV， Cavity |
| Electrical Property | Standing wave, phase, amplitude, insertion loss |
| Special Design | PIM control |
| Reliability | Reflow: 3 times, Thermal stress 288℃*10s*3 times |
| Product Area | 5G Multilayer |